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Plastic material solutions for the semiconductor industry

Of all the industries in which engineering plastics can help engineers solve design problems, none is more challenging than the semiconductor industry. Our semiconductor industry plastics are designed with the industry's often rigid and demanding environmental concerns in mind. In addition to this, our semiconductor industry specialists work directly with engineers to understand the unique challenges associated with every aspect of the semiconductor manufacturing process - from the beginning of the wafer processing cycle, through chip processing and handling, to packaging. 



Ceramic-filled PEEK

Ceramic-PEEK Test Socket Material is an advanced proprietary ceramic-filled PEEK compound created to meet the requirements for tight tolerance, high frequency IC chip socket test fixtures.

TORLON 4203 natural

This Torlon grade is commonly used for IC Test Sockets & Handlers, as well as, electrical connectors and insulators due to its high dielectric strength...

ESD plastics

Unmodified plastics are generally electrically insulating, but thermoplastics such as PEEK and Acetal can be modified to provide a range of electrically conductive, anti-static or static dissipative properties. 

PEEK natural

Polyetheretherketone (PEEK) - natural is a high performance, high temperature, semi-crystalline thermoplastic ...


Test socket in back-end chip testing

In the microchip manufacturing process it is important to test the chips under various conditions to ensure specific functionalities as well as durability. Different test sockets are used to test different microchips, as specified by integrated circuit designers. Substantially, different engineering plastic materials are used to make different test sockets and demand for high-performance plastic continues to grow rapidly.

How to meet the numerous requirements of CMP process

A very important step in silicon wafer production, is the Chemical Mechanical Planarization (CMP) process. The trend is towards larger wafer sizes, smaller chips with narrower line widths and feature sizes. The challenge is to find a material with the desired characteristics, as the CMP process requires components made of highly qualified materials. 
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