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DUPONT™ VESPEL® IS WIDELY USED FOR:

  • Semiconductor and material handling machinery
  • Chip test sockets
  • Wafer clamping rings
  • Valve seats and sealing applications
  • Spline couplings
  • High performance bearings and bushings
  • Locking fasteners for aerospace
  • Pivot bushings on unison ring

PERFORMANCE CHARACTERISTICS:

  • Long term performance at temperatures
           up to 260°C (500°F)
  • Outstanding sealing characteristics when mated                       against metals
  • Excellent unlubricated bearing and wear                                         properties (bearing grades)
  • Good electrical insulating properties
           (unfilled grades)

COMMON BRANDS:

  • DuPont™ Vespel® series materials
  • DTM PI (made in china:Chinese Academy of Sciences)
  • PLAVIS-N  series materials
  • Meldin® 7000 series materials

TECHNICAL RESOURCES

  Authentic DuPont™ Vespel® Booklet
​  Authentic DuPont™ Vespel® Brochure
​  Vespel® SP Data Sheet
​  Vespel® Machining Guide
EXPLORE OTHER PRODUCTS & SERVICES

DuPont™ Vespel® Polyimide

Extremely high temperature creep resistant plastic with excellent friction and wear characteristics

DuPont™ Vespel® Polyimide is an extremely high temperature, creep resistant plastic material that is often used in high heat environments where thermoplastic materials lose their mechanical properties. Vespel®, a lightweight alternative to metal, is available in a variety of formulations including unfilled grades and several low friction and wear grades.

The Vespel® SP Family of products are highly durable polyimides used in demanding applications where exceptional thermal resistance, low wear and/or low friction, strength and impact resistance are desired.

The Vespel® SCP Family exhibits enhanced mechanical properties and superior thermal stability.

Tech Tip– Vespel® material and its properties offer superior performance in high pressure, high temperature, and low temperature sealing applications.
EXPLORE DUPONT™ VESPEL® SP POLYIMIDE MATERIALS

TYPICAL PROPERTIES OF POLYIMIDE

  UNITS ASTM
TEST
SP-1
Unfilled
SP-211
15%
Graphite
and 10%
Teflon®
SCP-5000
Unfilled
SCP-5009
Graphite
Filled
Tensile strength 23°C MPa (kpsi) D638 86.2 44.8 163 116
Elongation at break,23°C % D638 7.5 3.5 7.5 3.0
Flexural modulus,23°C MPa (kpsi) D790 3,100 3,100 5,760 6,231
Compressive stress at
10% strain, 23°C
MPa (kpsi) D695 133 102 230 222
Deformation under
13.8 MPa (2,000 psi) load
% D621 0.14 13.8 0.05 0.03
Coefficient of friction at
PV = .875 MPa m/s
(25,000 psi-ft/min)*
    0.29 0.12 0.26 0.22
Coefficient of thermal
expansion
23–300°C
µm/m/K
(10-6 in/in-°F)
E831 54 54 47 44
Hardness Rockwell E D785 45–60 1–20 0.08 0.14
The information set forth herein is furnished free of charge and is based on technical data that DuPont believes to be reliable and falls within the normal range of properties. It is intended for use by persons having technical skill, at their own discretion and risk. This data should not be used to establish specification limits nor used alone as the basis of design. Handling precaution information is given with the understanding that those using it will satisfy themselves that their particular conditions of use present no health or safety hazards. Since conditions of product use and disposal are outside our control, we make no warranties, express or implied, and assume no liability in connection with any use of this information. As with any product, evaluation under end-use conditions prior to specification is essential. Nothing herein is to be taken as a license to operate or a recommendation to infringe on patents.

Caution: Do not use DuPont materials in medical applications involving implantation in the human body or contact with internal body fluids or tissues unless the material has been provided from DuPont under a written contract that is consistent with DuPont policy regarding medical applications and expressly acknowledges the contemplated use. For further information, please contact your DuPont representative. You may also request a copy of DuPont POLICY Regarding Medical Applications H-50103 and DuPont CAUTION Regarding Medical Applications H-50102. Copyright© 2015 DuPont.
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